Publication:

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

Date

2021
Proceedings Paper
https://doi.org/10.1109/ECTC32696.2021.00325
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Author(s)

Suhard, Samuel  
;
Kennes, Koen  
;
Bex, Pieter  
;
Jourdain, Anne  
;
Teugels, Lieve  
;
Walsby, Edward
;
Bolton, Chris
;
Patel, Jash
;
Ashraf, Huma
;
Barnett, Richard
;
Fodor, Ferenc  
;
Phommahaxay, Alain  
;
La Tulipe, Douglas Charles  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

na

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