Publication:
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
| dc.contributor.author | Suhard, Samuel | |
| dc.contributor.author | Kennes, Koen | |
| dc.contributor.author | Bex, Pieter | |
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Teugels, Lieve | |
| dc.contributor.author | Walsby, Edward | |
| dc.contributor.author | Bolton, Chris | |
| dc.contributor.author | Patel, Jash | |
| dc.contributor.author | Ashraf, Huma | |
| dc.contributor.author | Barnett, Richard | |
| dc.contributor.author | Fodor, Ferenc | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | La Tulipe, Douglas Charles | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Suhard, Samuel | |
| dc.contributor.imecauthor | Kennes, Koen | |
| dc.contributor.imecauthor | Bex, Pieter | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Teugels, Lieve | |
| dc.contributor.imecauthor | Fodor, Ferenc | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | La Tulipe, Douglas Charles | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
| dc.contributor.orcidimec | Jourdain, Anne::0000-0002-7610-0513 | |
| dc.contributor.orcidimec | Teugels, Lieve::0000-0002-6613-9414 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Kennes, Koen::0000-0002-5987-2167 | |
| dc.contributor.orcidimec | Fodor, Ferenc::0000-0001-9747-1981 | |
| dc.date.accessioned | 2023-08-10T12:10:27Z | |
| dc.date.available | 2023-06-20T10:37:03Z | |
| dc.date.available | 2023-08-10T12:10:27Z | |
| dc.date.issued | 2021 | |
| dc.identifier.doi | 10.1109/ECTC32696.2021.00325 | |
| dc.identifier.eisbn | 978-0-7381-4523-5 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/41967 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 2064 | |
| dc.source.conference | IEEE 71st Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 01-JUL 04, 2021 | |
| dc.source.conferencelocation | San Diego | |
| dc.source.endpage | 2070 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 7 | |
| dc.title | Demonstration of a collective hybrid die-to-wafer integration using glass carrier | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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