Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

dc.contributor.author	Yang, Yu
dc.contributor.author	Bender, Hugo
dc.contributor.author	Arstila, Kai
dc.contributor.author	Swinnen, Bart
dc.contributor.author	Verlinden, Bert
dc.contributor.author	De Wolf, Ingrid
dc.contributor.imecauthor	Bender, Hugo
dc.contributor.imecauthor	Swinnen, Bart
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned	2021-10-17T12:57:25Z
dc.date.available	2021-10-17T12:57:25Z
dc.date.issued	2008
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/14811
dc.identifier.url	http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6V47-4T2S02Y-5&_user=799533&_rdoc=1&_fmt=&_orig=search&_sort=d&view=c&
dc.source.beginpage	1517
dc.source.endpage	1520
dc.source.issue	8_9
dc.source.journal	Microelectronics Reliability
dc.source.volume	48
dc.title	Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures
dc.type	Journal article
dspace.entity.type	Publication
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