Publication:

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

Date

2024

Proceedings Paper

https://doi.org/10.1109/ESTC60143.2024.10712020

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Author(s)

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Gonzalez, Mario

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Phommahaxay, Alain

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Dhakras, Prathamesh

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Cuypers, Dieter H.

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Abdilla, Jonathan

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Prince, Kawsar Ahmed

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Bikaljevic, Djuro

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Deubler, Manuel

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Seroglazov, Pavel

Journal

N/A

Metrics

285 since deposited on 2025-02-15

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Acq. date: 2026-01-06