Publication:
Overlay scaling error reduction for hybrid Die-To-Wafer bonding
| dc.contributor.author | Bex, Pieter | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Brems, Steven | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | D'Have, Koen | |
| dc.contributor.author | Dhakras, Prathamesh | |
| dc.contributor.author | Cuypers, Dieter H. | |
| dc.contributor.author | Lin, Ye | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Abdilla, Jonathan | |
| dc.contributor.author | Prince, Kawsar Ahmed | |
| dc.contributor.author | Auer, Benedikt | |
| dc.contributor.author | Bikaljevic, Djuro | |
| dc.contributor.author | Deubler, Manuel | |
| dc.contributor.author | Moura, Thiago | |
| dc.contributor.author | Schmid, Stefan | |
| dc.contributor.author | Seroglazov, Pavel | |
| dc.contributor.imecauthor | Bex, Pieter | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Brems, Steven | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | D'Have, Koen | |
| dc.contributor.imecauthor | Dhakras, Prathamesh | |
| dc.contributor.imecauthor | Cuypers, Dieter H. | |
| dc.contributor.imecauthor | Lin, Ye | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Brems, Steven::0000-0002-0282-8528 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | D'have, Koen::0000-0002-5195-9241 | |
| dc.contributor.orcidimec | Dhakras, Prathamesh::0000-0003-4527-0533 | |
| dc.contributor.orcidimec | Lin, Ye::0000-0002-0681-908X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | D'havé, Koen::0000-0002-5195-9241 | |
| dc.date.accessioned | 2025-04-16T08:22:02Z | |
| dc.date.available | 2025-02-15T21:14:40Z | |
| dc.date.available | 2025-04-16T08:22:02Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/ESTC60143.2024.10712020 | |
| dc.identifier.eisbn | 979-8-3503-9036-0 | |
| dc.identifier.isbn | 979-8-3503-9037-7 | |
| dc.identifier.issn | 2687-9700 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45217 | |
| dc.publisher | IEEE | |
| dc.source.conference | 10th IEEE Electronics System-Integration Technology Conference (ESTC) | |
| dc.source.conferencedate | SEP 11-13, 2024 | |
| dc.source.conferencelocation | Berlin | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 6 | |
| dc.title | Overlay scaling error reduction for hybrid Die-To-Wafer bonding | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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