Publication:

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

Date

2024
Proceedings Paper
https://doi.org/10.1109/ESTC60143.2024.10712020
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dc.contributor.authorBex, Pieter
dc.contributor.authorGonzalez, Mario
dc.contributor.authorBrems, Steven
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorD'Have, Koen
dc.contributor.authorDhakras, Prathamesh
dc.contributor.authorCuypers, Dieter
dc.contributor.authorLin, Ye
dc.contributor.authorBeyne, Eric
dc.contributor.authorAbdilla, Jonathan
dc.contributor.authorPrince, Kawsar Ahmed
dc.contributor.authorAuer, Benedikt
dc.contributor.authorBikaljevic, Djuro
dc.contributor.authorDeubler, Manuel
dc.contributor.authorMoura, Thiago
dc.contributor.authorSchmid, Stefan
dc.contributor.authorSeroglazov, Pavel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorD'Have, Koen
dc.contributor.imecauthorDhakras, Prathamesh
dc.contributor.imecauthorCuypers, Dieter H.
dc.contributor.imecauthorLin, Ye
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecPhommahaxay, Alain::0000-0001-8672-2386
dc.contributor.orcidimecD'have, Koen::0000-0002-5195-9241
dc.contributor.orcidimecDhakras, Prathamesh::0000-0003-4527-0533
dc.contributor.orcidimecLin, Ye::0000-0002-0681-908X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecD'havé, Koen::0000-0002-5195-9241
dc.date.accessioned2025-04-16T08:22:02Z
dc.date.available2025-02-15T21:14:40Z
dc.date.available2025-04-16T08:22:02Z
dc.date.issued2024
dc.identifier.doi10.1109/ESTC60143.2024.10712020
dc.identifier.eisbn979-8-3503-9036-0
dc.identifier.isbn979-8-3503-9037-7
dc.identifier.issn2687-9700
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/45217
dc.publisherIEEE
dc.source.conference10th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 11-13, 2024
dc.source.conferencelocationBerlin
dc.source.journalN/A
dc.source.numberofpages6
dc.title

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

dc.typeProceedings paper
dspace.entity.typePublication
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