Publication:

Extending the roadmap beyond 3nm through system scaling boosters: A case study on buried power rail and backside power delivery

Date

2019
Proceedings Paper
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dc.contributor.authorRyckaert, Julien
dc.contributor.authorGupta, Anshul
dc.contributor.authorJourdain, Anne
dc.contributor.authorChava, Bharani
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVerkest, Diederik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T17:21:34Z
dc.date.available2021-10-27T17:21:34Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33917
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8731234
dc.source.beginpage50
dc.source.conference2019 Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedate12/03/2019
dc.source.conferencelocationSingapore Singapore
dc.title

Extending the roadmap beyond 3nm through system scaling boosters: A case study on buried power rail and backside power delivery

dc.typeProceedings paper
dspace.entity.typePublication
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