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Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
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Characterization of PVD TaN and ALD WNxCy copper diffusion barriers on a porous CVD low-k material
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2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Travaly, Youssef
;
Kemeling, N.
;
Maenhoudt, Mireille
;
Peeters, S.
;
Tokei, Zsolt
;
Abell, Thomas
;
Schuhmacher, Jörg
;
Turturro, S.
;
Vos, Ingrid
;
Eugene, Lino
;
Matsuki, N.
;
Fukazawa, A.
;
Goundar, K.
;
Satoh, K.
;
Kato, M.
;
Kaneko, S.
;
Vertommen, Johan
;
Sprey, Hessel
;
Van Hove, Marleen
;
Jonas, A.
;
Maex, Karen
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1942
since deposited on 2021-10-15
Acq. date: 2026-01-07
Citations
Metrics
Views
1942
since deposited on 2021-10-15
Acq. date: 2026-01-07
Citations