Publication:

Gate-Induced-Drain-Leakage (GIDL) in CMOS Enhanced by Mechanical Stress

Date

2022
Journal article
https://doi.org/10.1109/TED.2022.3154341
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dc.contributor.authorLee, Kookjin
dc.contributor.authorKaczer, Ben
dc.contributor.authorKruv, Anastasiia
dc.contributor.authorGonzalez, Mario
dc.contributor.authorEneman, Geert
dc.contributor.authorOkudur, Oguzhan Orkut
dc.contributor.authorGrill, Alexander
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorLee, Kookjin
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorOkudur, Oguzhan Orkut
dc.contributor.imecauthorGrill, Alexander
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecLee, Kookjin::0000-0002-9896-1090
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecOkudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimecGrill, Alexander::0000-0003-1615-1033
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2023-01-03T11:18:16Z
dc.date.available2022-03-26T02:08:24Z
dc.date.available2023-01-03T11:18:16Z
dc.date.embargo2022-04-30
dc.date.issued2022
dc.description.wosFundingTextThis work was supported in part by the European Commission through the 7th Framework Program (Collaborative project MORDRED) under Contract 261868.
dc.identifier.doi10.1109/TED.2022.3154341
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39531
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage2214
dc.source.endpage2217
dc.source.issue4
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages4
dc.source.volume69
dc.subject.keywordsIMPACT IONIZATION
dc.subject.keywordsMOSFETS
dc.subject.keywordsSTRAIN
dc.title

Gate-Induced-Drain-Leakage (GIDL) in CMOS Enhanced by Mechanical Stress

dc.typeJournal article
dspace.entity.typePublication
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