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Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
Publication:
Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
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Date
1999
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3936.pdf
1.04 MB
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Beyne, Eric
;
Van Puymbroeck, Jan
;
Heerman, M.
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Abstract
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1966
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations
Metrics
Views
1966
since deposited on 2021-10-14
Acq. date: 2025-12-10
Citations