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Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process
Publication:
Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process
Date
2003
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Degryse, Dominiek
;
Stoukatch, Serguei
;
Vandevelde, Bart
;
Beyne, Eric
Journal
Abstract
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1997
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1997
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations