Publication:

Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process

Date

2003
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T04:27:55Z
dc.date.available2021-10-15T04:27:55Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7482
dc.source.beginpage815
dc.source.conferenceEPTC - Electronics Packaging Technology Conference
dc.source.conferencedate10/12/2003
dc.source.conferencelocationSingapore
dc.source.endpage820
dc.title

Mechanical behavior of BEOL structures containing lowK dielectrics during bonding process

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions