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Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization
Publication:
Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization
Date
2001
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Satta, Alessandra
;
Beyer, Gerald
;
Maex, Karen
;
Elers, K.
;
Haukka, S.
;
Vantomme, Andre
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1896
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1896
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations