Publication:
Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization
Date
| dc.contributor.author | Satta, Alessandra | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.author | Elers, K. | |
| dc.contributor.author | Haukka, S. | |
| dc.contributor.author | Vantomme, Andre | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.contributor.imecauthor | Vantomme, Andre | |
| dc.date.accessioned | 2021-10-14T17:45:42Z | |
| dc.date.available | 2021-10-14T17:45:42Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5632 | |
| dc.source.beginpage | D6.5.1 | |
| dc.source.conference | Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics | |
| dc.source.conferencedate | 23/04/2000 | |
| dc.source.conferencelocation | San Francisco, CA USA | |
| dc.source.endpage | D6.5.6 | |
| dc.title | Properties of TiN thin films deposited by ALCVD as barriers for Cu metallization | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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