New plating bath for electroless copper deposition on sputtered barrier layers

dc.contributor.author	Lantasov, Yuri
dc.contributor.author	Palmans, Roger
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Maex, Karen
dc.date.accessioned	2021-10-14T13:14:18Z
dc.date.available	2021-10-14T13:14:18Z
dc.date.embargo	9999-12-31
dc.date.issued	2000
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/4517
dc.source.beginpage	441
dc.source.endpage	447
dc.source.issue	1_4
dc.source.journal	Microelectronic Engineering
dc.source.volume	50
dc.title	New plating bath for electroless copper deposition on sputtered barrier layers
dc.type	Journal article
dspace.entity.type	Publication
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