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Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
Publication:
Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules
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Date
2011
Proceedings Paper
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22430.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Maestre Caro, Arantxa
;
Travaly, Youssef
;
Maes, Guido
;
Borghs, Gustaaf
;
Armini, Silvia
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1877
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Metrics
Views
1877
since deposited on 2021-10-19
1
last month
Acq. date: 2025-12-15
Citations