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Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

Date

2011
Proceedings Paper
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dc.contributor.authorMaestre Caro, Arantxa
dc.contributor.authorTravaly, Youssef
dc.contributor.authorMaes, Guido
dc.contributor.authorBorghs, Gustaaf
dc.contributor.authorArmini, Silvia
dc.contributor.imecauthorBorghs, Gustaaf
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.date.accessioned2021-10-19T15:51:00Z
dc.date.available2021-10-19T15:51:00Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19353
dc.source.beginpage10.4
dc.source.conferenceIEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM
dc.source.conferencedate9/05/2011
dc.source.conferencelocationDresden Germany
dc.title

Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules

dc.typeProceedings paper
dspace.entity.typePublication
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