Test-architecture optimization and test scheduling for TSV-based 3D stacked ICs

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Author(s)

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Chakrabarty, Krishnendu

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Goel, Sandeep K.

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Marinissen, Erik Jan

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Journal

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Metrics

1930 since deposited on 2021-10-19

Acq. date: 2025-10-23