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Inductive links for 3D stacked chip-to-chip communication
Publication:
Inductive links for 3D stacked chip-to-chip communication
Date
2019
Proceedings Paper
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40015.pdf
1.33 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Pantano, Nicolas
;
Kim, Soon-Wook
;
Van der Plas, Geert
;
Beyne, Eric
Journal
Abstract
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1875
since deposited on 2021-10-27
Acq. date: 2025-10-27
Citations
Metrics
Views
1875
since deposited on 2021-10-27
Acq. date: 2025-10-27
Citations