Publication:

Inductive links for 3D stacked chip-to-chip communication

Date

2019
Proceedings Paper
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dc.contributor.authorSun, Xiao
dc.contributor.authorPantano, Nicolas
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T19:13:12Z
dc.date.available2021-10-27T19:13:12Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34085
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811205
dc.source.beginpage1215
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas vegas, NV USA
dc.source.endpage1220
dc.title

Inductive links for 3D stacked chip-to-chip communication

dc.typeProceedings paper
dspace.entity.typePublication
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