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Thermal compression bonding: understanding heat transfer by in situ measurement and modeling
Publication:
Thermal compression bonding: understanding heat transfer by in situ measurement and modeling
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Date
2017
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Bex, Pieter
;
Wang, Teng
;
Cherman, Vladimir
;
Lofrano, Melina
;
Capuz, Giovanni
;
Sleeckx, Erik
;
Beyne, Eric
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1846
since deposited on 2021-10-24
1
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1846
since deposited on 2021-10-24
1
last month
Acq. date: 2025-12-15
Citations