Publication:

Thermal compression bonding: understanding heat transfer by in situ measurement and modeling

Date

2017
Proceedings Paper
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dc.contributor.authorBex, Pieter
dc.contributor.authorWang, Teng
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T02:59:02Z
dc.date.available2021-10-24T02:59:02Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27843
dc.source.beginpage392
dc.source.conferenceIEEE Electronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2017
dc.source.conferencelocationOrlando, FL USA
dc.source.endpage398
dc.title

Thermal compression bonding: understanding heat transfer by in situ measurement and modeling

dc.typeProceedings paper
dspace.entity.typePublication
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