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Impact of barrier integrity on liner reliability in 3D through silicon vias
Publication:
Impact of barrier integrity on liner reliability in 3D through silicon vias
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Date
2013
Proceedings Paper
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25548.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Civale, Yann
;
Oba, Yoshiyuki
;
Cockburn, Andrew
;
Park, Jin Hee
;
Beyne, Eric
;
De Wolf, Ingrid
;
Croes, Kristof
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Acq. date: 2025-12-12
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since deposited on 2021-10-21
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Acq. date: 2025-12-12
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Downloads
1
since deposited on 2021-10-21
Acq. date: 2025-12-12
Views
1890
since deposited on 2021-10-21
1
last month
Acq. date: 2025-12-12
Citations