Publication:

Impact of barrier integrity on liner reliability in 3D through silicon vias

Date

2013
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorLi, Yunlong
dc.contributor.authorCivale, Yann
dc.contributor.authorOba, Yoshiyuki
dc.contributor.authorCockburn, Andrew
dc.contributor.authorPark, Jin Hee
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-21T09:22:32Z
dc.date.available2021-10-21T09:22:32Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22692
dc.source.beginpage5C.5
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate14/04/2013
dc.source.conferencelocationMonterey, CA USA
dc.title

Impact of barrier integrity on liner reliability in 3D through silicon vias

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
25548.pdf
Size:
358.42 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions