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Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Publication:
Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10
Date
2009
Meeting abstract
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18023.pdf
201.55 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Luhn, Ole
;
Radisic, Alex
;
Vereecken, Philippe
;
Van Hoof, Chris
;
Ruythooren, Wouter
;
Celis, Jean-Pierre
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Abstract
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1927
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1927
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations