Publication:

Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10

Date

2009
Meeting abstract
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dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-18T00:17:43Z
dc.date.available2021-10-18T00:17:43Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15766
dc.source.beginpage997
dc.source.conference215th Electrochemical Society Spring Meeting
dc.source.conferencedate24/05/2009
dc.source.conferencelocationSan Fransisco, CA USA
dc.title

Characteristics of copper electrodeposits on featureless substrates and in microvias with aspect ratio up to 10

dc.typeMeeting abstract
dspace.entity.typePublication
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