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Testing 3D chips containing through-silicon vias
Publication:
Testing 3D chips containing through-silicon vias
Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
Zorian, Yervant
Journal
Abstract
Description
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1861
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Acq. date: 2025-10-28
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Metrics
Views
1861
since deposited on 2021-10-18
1
last week
Acq. date: 2025-10-28
Citations