Publication:
Testing 3D chips containing through-silicon vias
Date
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.author | Zorian, Yervant | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-18T00:38:40Z | |
| dc.date.available | 2021-10-18T00:38:40Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/15833 | |
| dc.source.conference | IEEE International Test Conference - ITC | |
| dc.source.conferencedate | 1/11/2009 | |
| dc.source.conferencelocation | Austin, TX USA | |
| dc.title | Testing 3D chips containing through-silicon vias | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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