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Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)

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114 since deposited on 2024-09-14
37last month
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Acq. date: 2025-12-15

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371 since deposited on 2024-09-14
Acq. date: 2025-12-15

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