Publication:
Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)
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367 since deposited on 2024-09-14
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63 since deposited on 2024-09-14
Acq. date: 2025-10-23
Views
367 since deposited on 2024-09-14
Acq. date: 2025-10-23
Citations