Publication:

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)

Date

2024
Journal Article Correction
https://doi.org/10.1117/1.JOM.4.1.019801
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-0778-2669
cris.virtual.orcid0000-0001-7319-8132
cris.virtual.orcid0000-0003-0680-4969
cris.virtual.orcid0000-0002-8999-2303
cris.virtual.orcid0000-0002-3732-1874
cris.virtual.orcid0000-0003-3822-5953
cris.virtual.orcid0000-0001-7947-8098
cris.virtualsource.department00e049bc-79d0-4325-b281-791064db1c14
cris.virtualsource.department2f5b3e75-5f6a-4499-9611-c231e9f91c94
cris.virtualsource.departmente2b142d3-d92c-4859-9ac7-498d018fed07
cris.virtualsource.department5047e949-e443-4145-b672-6bc4bc637247
cris.virtualsource.department2e82cf50-caf9-4f22-b2e1-c1a7ff000017
cris.virtualsource.department99f46578-0b77-4a3f-b8e5-a6879cd2ea9a
cris.virtualsource.department8cc84abf-ca47-418d-b9f4-844fc78f8227
cris.virtualsource.orcid00e049bc-79d0-4325-b281-791064db1c14
cris.virtualsource.orcid2f5b3e75-5f6a-4499-9611-c231e9f91c94
cris.virtualsource.orcide2b142d3-d92c-4859-9ac7-498d018fed07
cris.virtualsource.orcid5047e949-e443-4145-b672-6bc4bc637247
cris.virtualsource.orcid2e82cf50-caf9-4f22-b2e1-c1a7ff000017
cris.virtualsource.orcid99f46578-0b77-4a3f-b8e5-a6879cd2ea9a
cris.virtualsource.orcid8cc84abf-ca47-418d-b9f4-844fc78f8227
dc.contributor.authorCoenen, David
dc.contributor.authorKim, Minkyu
dc.contributor.authorOprins, Herman
dc.contributor.authorBan, Yoojin
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorKim, Minkyu
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecKim, Minkyu::0000-0002-8999-2303
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.contributor.orcidimecVelenis, Dimitrios::0000-0001-7947-8098
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2025-02-06T10:46:28Z
dc.date.available2024-09-14T17:21:08Z
dc.date.available2025-02-06T10:46:28Z
dc.date.embargo2024-01-31
dc.date.issued2024
dc.identifier.doi10.1117/1.JOM.4.1.019801
dc.identifier.issn1932-5150
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44486
dc.publisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
dc.source.beginpage019801
dc.source.endpageN/A
dc.source.issue1
dc.source.journalJOURNAL OF OPTICAL MICROSYSTEMS
dc.source.numberofpages1
dc.source.volume4
dc.title

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic-electronic transceivers ( vol 4 , 011004 , 2023)

dc.typeJournal article correction
dspace.entity.typePublication
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