Publication:

CMOS area scaling and the need for high aspect ratio vias

Date

2018
Proceedings Paper
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dc.contributor.authorBriggs, Basoene
dc.contributor.authorGuissi, Sofiane
dc.contributor.authorWilson, Chris
dc.contributor.authorRyckaert, Julien
dc.contributor.authorPaolillo, Sara
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorVersluijs, Janko
dc.contributor.authorLorant, Christophe
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.authorSherazi, Yasser
dc.contributor.authorWeckx, Pieter
dc.contributor.authorKljucar, Luka
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorDe Heyn, Vincent
dc.contributor.authorGupta, Anshul
dc.contributor.authorErvin, Joseph
dc.contributor.authorKamon, Matt
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorGuissi, Sofiane
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorSherazi, Yasser
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.imecauthorGupta, Anshul
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.date.accessioned2021-10-25T16:56:41Z
dc.date.available2021-10-25T16:56:41Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30327
dc.source.beginpage453
dc.source.conference50th International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate9/09/2018
dc.source.conferencelocationTokyo Japan
dc.source.endpage454
dc.title

CMOS area scaling and the need for high aspect ratio vias

dc.typeProceedings paper
dspace.entity.typePublication
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