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Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices

 
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorRagnarsson, Lars-Ake
dc.contributor.authorOniki, Yusuke
dc.contributor.authorFranco, Jacopo
dc.contributor.authorVandooren, Anne
dc.contributor.authorBrus, Stephan
dc.contributor.authorLeonhardt, A.
dc.contributor.authorSippola, P.
dc.contributor.authorIvanova, T.
dc.contributor.authorVerni, G. Alessio
dc.contributor.authorChang, R-J
dc.contributor.authorXie, Q.
dc.contributor.authorGivens, M.
dc.contributor.authorMitard, Jerome
dc.contributor.authorBiesemans, Serge
dc.contributor.authorDentoni Litta, Eugenio
dc.contributor.authorHoriguchi, Naoto
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorRagnarsson, Lars-Ake
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorMitard, Jerome
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.imecauthorDentoni Litta, Eugenio
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecRagnarsson, Lars-Ake::0000-0003-1057-8140
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecBrus, Stephan::0000-0003-3554-0640
dc.contributor.orcidimecMitard, Jerome::0000-0002-7422-079X
dc.contributor.orcidimecDentoni Litta, Eugenio::0000-0003-0333-376X
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2022-08-25T14:12:43Z
dc.date.available2022-07-09T02:27:24Z
dc.date.available2022-08-25T14:12:43Z
dc.date.issued2021
dc.identifier.doi10.1109/IEDM19574.2021.9720527
dc.identifier.eisbn978-1-6654-2572-8
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40080
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedateDEC 11-16, 2021
dc.source.conferencelocationSan Francisco
dc.source.journalna
dc.source.numberofpages4
dc.title

Dipole-First Gate Stack as a Scalable and Thermal Budget Flexible Multi-Vt Solution for Nanosheet/CFET Devices

dc.typeProceedings paper
dspace.entity.typePublication
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