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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Publication:
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Date
2023
Proceedings Paper
https://doi.org/10.1109/ECTC51909.2023.00241
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Iacovo, Serena
;
D'have, Koen
;
Okudur, Oguzhan Orkut
;
De Vos, Joeri
;
Uhrmann, Thomas
;
Plach, Thomas
;
Conard, Thierry
;
Meersschaut, Johan
;
Bex, Pieter
;
Brems, Steven
;
Phommahaxay, Alain
;
Gonzalez, Mario
;
Witters, Liesbeth
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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1083
since deposited on 2023-10-23
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item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations
Metrics
Views
1083
since deposited on 2023-10-23
426
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations