Publication:
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
| dc.contributor.author | Iacovo, Serena | |
| dc.contributor.author | D'have, Koen | |
| dc.contributor.author | Okudur, Oguzhan Orkut | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Uhrmann, Thomas | |
| dc.contributor.author | Plach, Thomas | |
| dc.contributor.author | Conard, Thierry | |
| dc.contributor.author | Meersschaut, Johan | |
| dc.contributor.author | Bex, Pieter | |
| dc.contributor.author | Brems, Steven | |
| dc.contributor.author | Phommahaxay, Alain | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Witters, Liesbeth | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Iacovo, Serena | |
| dc.contributor.imecauthor | D'have, Koen | |
| dc.contributor.imecauthor | Okudur, Oguzhan Orkut | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Conard, Thierry | |
| dc.contributor.imecauthor | Meersschaut, Johan | |
| dc.contributor.imecauthor | Bex, Pieter | |
| dc.contributor.imecauthor | Brems, Steven | |
| dc.contributor.imecauthor | Phommahaxay, Alain | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Witters, Liesbeth | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
| dc.contributor.orcidimec | D'have, Koen::0000-0002-5195-9241 | |
| dc.contributor.orcidimec | Okudur, Oguzhan Orkut::0000-0002-4790-7772 | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Conard, Thierry::0000-0002-4298-5851 | |
| dc.contributor.orcidimec | Meersschaut, Johan::0000-0003-2467-1784 | |
| dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
| dc.contributor.orcidimec | Brems, Steven::0000-0002-0282-8528 | |
| dc.contributor.orcidimec | Phommahaxay, Alain::0000-0001-8672-2386 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Beyer, Gerald::0009-0001-0376-866X | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2023-11-29T07:52:42Z | |
| dc.date.available | 2023-10-23T17:27:28Z | |
| dc.date.available | 2023-11-29T07:52:42Z | |
| dc.date.issued | 2023 | |
| dc.identifier.doi | 10.1109/ECTC51909.2023.00241 | |
| dc.identifier.eisbn | 979-8-3503-3498-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42914 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 1410 | |
| dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
| dc.source.conferencelocation | Orlando | |
| dc.source.endpage | 1417 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 8 | |
| dc.title | A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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