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Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits
Publication:
Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits
Date
2018-11
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
;
Fodor, Ferenc
;
Podpod, Arnita
;
Stucchi, Michele
;
Jian, Yu-Rong
;
Wu, Cheng-Wen
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1890
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations
Metrics
Views
1890
since deposited on 2021-10-25
Acq. date: 2025-10-25
Citations