Publication:
Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits
Date
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.author | Fodor, Ferenc | |
| dc.contributor.author | Podpod, Arnita | |
| dc.contributor.author | Stucchi, Michele | |
| dc.contributor.author | Jian, Yu-Rong | |
| dc.contributor.author | Wu, Cheng-Wen | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Fodor, Ferenc | |
| dc.contributor.imecauthor | Podpod, Arnita | |
| dc.contributor.imecauthor | Stucchi, Michele | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-25T22:59:36Z | |
| dc.date.available | 2021-10-25T22:59:36Z | |
| dc.date.issued | 2018-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/31290 | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8626258 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | IEEE International Test Conference - ITC'18 | |
| dc.source.conferencedate | 28/10/2018 | |
| dc.source.conferencelocation | Phoenix, AZ USA | |
| dc.source.endpage | 10 | |
| dc.title | Solutions to multiple probing challenges for test access to multi-die stacked integrated circuits | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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