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Cu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections

Date

2018
Proceedings Paper
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dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorAdelmann, Christoph
dc.contributor.authorVan Elshocht, Sven
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorAdelmann, Christoph
dc.contributor.imecauthorVan Elshocht, Sven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecAdelmann, Christoph::0000-0002-4831-3159
dc.contributor.orcidimecVan Elshocht, Sven::0000-0002-6512-1909
dc.date.accessioned2021-10-25T20:29:33Z
dc.date.available2021-10-25T20:29:33Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30982
dc.identifier.urlhttp://www.ssdm.jp/SSDM2018_TechnicalProgram-All_Sep11-13.pdf?d=20180824
dc.source.beginpage469
dc.source.conference50th International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate9/09/2018
dc.source.conferencelocationTokyo Japan
dc.source.endpage470
dc.title

Cu resistivity and intrinsic EM-reliability study in Ta/Cu, Co/Cu and Ru/Cu systems for advanced BEOL Cu interconnections

dc.typeProceedings paper
dspace.entity.typePublication
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