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Thermo-mechanical stress induced by CPI on 3D interposer package
Publication:
Thermo-mechanical stress induced by CPI on 3D interposer package
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Date
2014
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lofrano, Melina
;
Gonzalez, Mario
Journal
Abstract
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1755
since deposited on 2021-10-22
Acq. date: 2025-12-15
Citations
Metrics
Views
1755
since deposited on 2021-10-22
Acq. date: 2025-12-15
Citations