Publication:
Thermo-mechanical stress induced by CPI on 3D interposer package
Date
| dc.contributor.author | Lofrano, Melina | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.imecauthor | Lofrano, Melina | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.date.accessioned | 2021-10-22T03:13:29Z | |
| dc.date.available | 2021-10-22T03:13:29Z | |
| dc.date.issued | 2014 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24161 | |
| dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6813821&contentType=Conference+Publications | |
| dc.source.beginpage | 1 | |
| dc.source.conference | 15th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE | |
| dc.source.conferencedate | 7/04/2014 | |
| dc.source.conferencelocation | Gent Belgium | |
| dc.source.endpage | 5 | |
| dc.title | Thermo-mechanical stress induced by CPI on 3D interposer package | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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