Publication:
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
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1447 since deposited on 2023-01-15
Acq. date: 2025-10-25
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Views
1447 since deposited on 2023-01-15
Acq. date: 2025-10-25
Citations