Publication:

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision

Date

2023

Journal article

https://doi.org/10.1109/JSTQE.2022.3223641

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Published version 3.86 MB

Journal

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS

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1471 since deposited on 2023-01-15

3last month

Acq. date: 2026-04-05