Publication:
Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision
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1468 since deposited on 2023-01-15
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Acq. date: 2026-02-28
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Views
1468 since deposited on 2023-01-15
8last month
1last week
Acq. date: 2026-02-28
Citations