Publication:

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision

Date

2023
Journal article
https://doi.org/10.1109/JSTQE.2022.3223641
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dc.contributor.authorMarinins, Aleksandrs
dc.contributor.authorHansch, Sebastian
dc.contributor.authorSar, Huseyin
dc.contributor.authorChancerel, Francois
dc.contributor.authorGolshani, Negin
dc.contributor.authorWang, Hsiao-Lun
dc.contributor.authorTsiara, Artemisia
dc.contributor.authorCoenen, David
dc.contributor.authorVerheyen, Peter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorDe Koninck, Yannick
dc.contributor.authorYilmaz, Ozan
dc.contributor.authorMorthier, Geert
dc.contributor.authorSchleicher, Filip
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorSmyth, Stuart
dc.contributor.authorMcKee, Andrew
dc.contributor.authorBan, Yoojin
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorLa Tulipe, Douglas Charles
dc.contributor.imecauthorMarinins, Aleksandrs
dc.contributor.imecauthorSar, Huseyin
dc.contributor.imecauthorChancerel, Francois
dc.contributor.imecauthorGolshani, Negin
dc.contributor.imecauthorWang, Hsiao-Lun
dc.contributor.imecauthorTsiara, Artemisia
dc.contributor.imecauthorCoenen, David
dc.contributor.imecauthorVerheyen, Peter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorDe Koninck, Yannick
dc.contributor.imecauthorYilmaz, Ozan
dc.contributor.imecauthorMorthier, Geert
dc.contributor.imecauthorSchleicher, Filip
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorBan, Yoojin
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.orcidimecMarinins, Aleksandrs::0000-0002-0728-6684
dc.contributor.orcidimecChancerel, Francois::0000-0003-4512-1634
dc.contributor.orcidimecTsiara, Artemisia::0000-0002-5612-6468
dc.contributor.orcidimecCoenen, David::0000-0002-3732-1874
dc.contributor.orcidimecVerheyen, Peter::0000-0002-8245-9442
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecSchleicher, Filip::0000-0003-3630-7285
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBan, Yoojin::0000-0001-7319-8132
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecMorthier, Geert::0000-0003-1819-6489
dc.date.accessioned2023-03-30T14:39:55Z
dc.date.available2023-01-15T03:15:18Z
dc.date.available2023-03-30T14:39:55Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.identifier.doi10.1109/JSTQE.2022.3223641
dc.identifier.issn1077-260X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40980
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpageArt. 8200311
dc.source.endpagena
dc.source.issue6
dc.source.journalIEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
dc.source.numberofpages11
dc.source.volume29
dc.title

Wafer-Scale Hybrid Integration of InP DFB Lasers on Si Photonics by Flip-Chip Bonding With sub-300 nm Alignment Precision

dc.typeJournal article
dspace.entity.typePublication
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