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Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding

Date

2020
Proceedings Paper
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dc.contributor.authorNagano, Fuya
dc.contributor.authorIacovo, Serena
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorSleeckx, Erik
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-29T01:15:50Z
dc.date.available2021-10-29T01:15:50Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35637
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/09804.0021ecst
dc.source.conferencePRiME 2020: Semiconductor Wafer Bonding: Science, Technology, and Applications 16
dc.source.conferencedate4/10/2020
dc.source.conferencelocationHonolulu (virtual) US
dc.title

Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding

dc.typeProceedings paper
dspace.entity.typePublication
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