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Wet-chemical deposition of metals for advanced semiconductor technology nodes: Rh3+solution stability and Rh electrodeposition

 
dc.contributor.authorPhilipsen, Harold
dc.contributor.authorKim, Youjung
dc.contributor.authorYoo, Bongyoung
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.date.accessioned2024-09-19T09:50:25Z
dc.date.available2024-06-17T17:57:40Z
dc.date.available2024-09-19T09:50:25Z
dc.date.issued2024
dc.description.wosFundingTextThe authors would like to thank the core partners of IMEC 's Industrial Affiliation Program (IIAP) and the members of the MCA team for executing AFM and TEM analyses. This research was supported by MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0008745) supervised by KIAT (Korea Institute for Advancement of Technology) .
dc.identifier.doi10.1016/j.electacta.2024.144331
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44065
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD
dc.source.beginpageArt. 144331
dc.source.endpageN/A
dc.source.issueAugust
dc.source.journalELECTROCHIMICA ACTA
dc.source.numberofpages11
dc.source.volume494
dc.subject.keywordsION-EXCHANGE CHROMATOGRAPHY
dc.subject.keywordsHYDROGEN-EVOLUTION REACTION
dc.subject.keywordsSUPERCONFORMAL FILM GROWTH
dc.subject.keywordsHYDROCHLORIC-ACID SOLUTION
dc.subject.keywordsPAPER ELECTROPHORESIS
dc.subject.keywordsRHODIUM(III) COMPLEXES
dc.subject.keywordsCYCLIC VOLTAMMETRY
dc.subject.keywordsNOBLE-METALS
dc.subject.keywordsPOLYCRYSTALLINE RHODIUM
dc.subject.keywordsSOLUTION CHEMISTRY
dc.title

Wet-chemical deposition of metals for advanced semiconductor technology nodes: Rh3+solution stability and Rh electrodeposition

dc.typeJournal article
dspace.entity.typePublication
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