Publication:

Reverse tip sample scanning for precise and high-throughput electrical characterization of advanced nodes

Date

2019
Proceedings Paper
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dc.contributor.authorCelano, Umberto
dc.contributor.authorHantschel, Thomas
dc.contributor.authorBoehme, Thijs
dc.contributor.authorKanniainen, A.
dc.contributor.authorWouters, Lennaert
dc.contributor.authorBender, Hugo
dc.contributor.authorBosman, Niels
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorFolkersma, Steven
dc.contributor.authorParedis, Kristof
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorvan der Heide, Paul
dc.contributor.imecauthorCelano, Umberto
dc.contributor.imecauthorHantschel, Thomas
dc.contributor.imecauthorBoehme, Thijs
dc.contributor.imecauthorWouters, Lennaert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorFolkersma, Steven
dc.contributor.imecauthorParedis, Kristof
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorvan der Heide, Paul
dc.contributor.orcidimecCelano, Umberto::0000-0002-2856-3847
dc.contributor.orcidimecHantschel, Thomas::0000-0001-9476-4084
dc.contributor.orcidimecWouters, Lennaert::0000-0002-6730-9542
dc.contributor.orcidimecParedis, Kristof::0000-0002-5163-4164
dc.contributor.orcidimecvan der Heide, Paul::0000-0001-6292-0329
dc.date.accessioned2021-10-27T07:54:18Z
dc.date.available2021-10-27T07:54:18Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/32667
dc.source.beginpage90
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM 2019
dc.source.conferencedate7/12/2019
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage93
dc.title

Reverse tip sample scanning for precise and high-throughput electrical characterization of advanced nodes

dc.typeProceedings paper
dspace.entity.typePublication
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