Publication:

Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers

Date

2011
Journal article
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dc.contributor.authorZhao, Larry
dc.contributor.authorLofrano, Melina
dc.contributor.authorCroes, Kristof
dc.contributor.authorVan Besien, Els
dc.contributor.authorTokei, Zsolt
dc.contributor.authorWilson, Chris
dc.contributor.authorDegraeve, Robin
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorBeyer, Gerald
dc.contributor.authorClaeys, Cor
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVan Besien, Els
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVan Besien, Els::0000-0002-5174-2229
dc.date.accessioned2021-10-19T22:26:32Z
dc.date.available2021-10-19T22:26:32Z
dc.date.issued2011
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/20221
dc.source.beginpage662
dc.source.endpage666
dc.source.issue1
dc.source.journalThin Solid Films
dc.source.volume520
dc.title

Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers

dc.typeJournal article
dspace.entity.typePublication
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