Publication:

Thermal and Mechanical characterization of embedded PTCQ packaging test chip die

Date

2023

Proceedings Paper

https://doi.org/10.1109/ECTC51909.2023.00096

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Author(s)

;

;

Cherman, Vladimir

;

;

Van der Plas, Geert

Journal

N/A

Statistics

879 since deposited on 2023-10-24

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Acq. date: 2026-06-05