Publication:
Thermal and Mechanical characterization of embedded PTCQ packaging test chip die
| dc.contributor.author | Weis, Gerald | |
| dc.contributor.author | Schwarz, Timo | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Stahr, Hannes | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.orcidimec | Cherman, Vladimir::0000-0002-8068-9236 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.date.accessioned | 2024-03-11T11:13:26Z | |
| dc.date.available | 2023-10-24T17:34:43Z | |
| dc.date.available | 2024-03-11T11:13:26Z | |
| dc.date.issued | 2023 | |
| dc.identifier.doi | 10.1109/ECTC51909.2023.00096 | |
| dc.identifier.eisbn | 979-8-3503-3498-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42951 | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 537 | |
| dc.source.conference | IEEE 73rd Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 30-JUN 02, 2023 | |
| dc.source.conferencelocation | Orlando | |
| dc.source.endpage | 541 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 5 | |
| dc.title | Thermal and Mechanical characterization of embedded PTCQ packaging test chip die | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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