Publication:

On-Chip I/O ESD Protection for GaN-on-SOI Integrated Circuits

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-8934-6774
cris.virtualsource.department388201b2-2375-42a8-b1c1-028899a5ce4e
cris.virtualsource.orcid388201b2-2375-42a8-b1c1-028899a5ce4e
dc.contributor.authorSamperi, Katia
dc.contributor.authorChatterjee, Urmimala
dc.contributor.authorPennisi, Salvatore
dc.date.accessioned2026-06-15T08:38:55Z
dc.date.available2026-06-15T08:38:55Z
dc.date.createdwos2026-02-10
dc.date.issued2025
dc.description.abstractGallium Nitride (GaN) platforms are reshaping the efficiency, frequency, and form factor of power electronics integrated circuits. However, the absence of p-channel transistors of GaN technologies makes traditional electrostatic discharge (ESD) protection for integrated circuits (ICs) ineffective. This letter proposes a protection network for input/output pins that leverages the unique conduction properties of enhancement-mode GaN transistors in the third quadrant of their current-voltage (I-V) plane. Experimental measurements confirm the viability of the proposed solution as a library element of the process design kit.
dc.description.wosFundingTextThis work was supported by the European Commission through project ASCENT+: Access to European Infrastructure for Nanoelectronics, funded under H2020, grant 871130.
dc.identifier.doi10.1109/iscas56072.2025.11044165
dc.identifier.isbn979-8-3503-5684-7
dc.identifier.issn0271-4302
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59680
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Symposium on Circuits and Systems (ISCAS)
dc.source.conferencedate2025-05-25
dc.source.conferencelocationLondon
dc.source.journal2025 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, ISCAS
dc.source.numberofpages4
dc.subject.keywordsPOWER
dc.subject.keywordsFAILURE
dc.title

On-Chip I/O ESD Protection for GaN-on-SOI Integrated Circuits

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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