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iN5 EUV Single Expose Patterning Evaluation for Via Layers

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dc.contributor.authorDas, Argho
dc.contributor.authorBlanco, Victor
dc.contributor.authorDas, Sayantan
dc.contributor.authorKissoon, Nicola
dc.contributor.authorHalder, Sandip
dc.contributor.authorDusa, Mircea
dc.contributor.imecauthorDas, Argho
dc.contributor.imecauthorBlanco, Victor
dc.contributor.imecauthorDas, Sayantan
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorDusa, Mircea
dc.contributor.orcidimecDas, Argho::0000-0003-3804-1919
dc.contributor.orcidimecBlanco, Victor::0000-0003-4308-0381
dc.contributor.orcidimecDas, Sayantan::0000-0002-3031-0726
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.accessioned2023-01-19T14:24:35Z
dc.date.available2022-05-22T02:19:15Z
dc.date.available2023-01-19T14:24:35Z
dc.date.issued2021
dc.identifier.doi10.1117/12.2600938
dc.identifier.eisbn978-1-5106-4553-0
dc.identifier.isbn978-1-5106-4552-3
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39875
dc.publisherSPIE-INT SOC OPTICAL ENGINEERING
dc.source.beginpage1185418
dc.source.conferenceInternational Conference on Extreme Ultraviolet Lithography
dc.source.conferencedateSEP 27-OCT 01, 2021
dc.source.conferencelocationVirtual
dc.source.journalProceedings of SPIE
dc.source.numberofpages11
dc.source.volume11854
dc.title

iN5 EUV Single Expose Patterning Evaluation for Via Layers

dc.typeProceedings paper
dspace.entity.typePublication
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