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Optoelectronics packaging for efficient chip-to-waveguide coupling
Publication:
Optoelectronics packaging for efficient chip-to-waveguide coupling
Date
2013
Presentation
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28145.pdf
2.05 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Van Steenberge, Geert
;
Bosman, Erwin
;
Missinne, Jeroen
;
Van Hoe, Bram
;
Kaur, Kamalpreet
;
Kalathimekkad, Sandeep
;
Teigell Beneitez, Nuria
;
Elmogi, Ahmed
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Abstract
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1912
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Citations
Metrics
Views
1912
since deposited on 2021-10-21
408
item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations