Publication:

Optoelectronics packaging for efficient chip-to-waveguide coupling

Date

2013
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dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorBosman, Erwin
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorKaur, Kamalpreet
dc.contributor.authorKalathimekkad, Sandeep
dc.contributor.authorTeigell Beneitez, Nuria
dc.contributor.authorElmogi, Ahmed
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorKaur, Kamalpreet
dc.contributor.imecauthorTeigell Beneitez, Nuria
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.date.accessioned2021-10-21T13:34:05Z
dc.date.available2021-10-21T13:34:05Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23271
dc.source.conferenceEuropean Conference and Exhibition on Optical Communication: European Cluster in Optical Interconnects Workshop
dc.source.conferencedate22/09/2013
dc.source.conferencelocationLondon UK
dc.title

Optoelectronics packaging for efficient chip-to-waveguide coupling

dc.typeOral presentation
dspace.entity.typePublication
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